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ITC Institutes Investigation (337-TA-859) Regarding Certain Integrated Circuit Chips




by:
Eric W. Schweibenz
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. - Alexandria Office

 
October 24, 2012

Previously published on October 22, 2012

On October 18, 2012, the U.S. International Trade Commission issued a press release announcing their vote to institute an investigation of Certain Integrated Circuit Chips and Products Containing Same (Inv. No. 337-TA-859).

The investigation is based on a September 19, 2012 complaint and October 5, 2012 letter supplementing the complaint filed by Realtek Semiconductor Corporation of Taiwan alleging violation of Section 337 in the importation into the U.S. and sale of certain integrated circuit chips that include bond pad structures or level shifter circuitry and products containing the same that infringe one or more claims of U.S. Patent Nos. 6,787,928 and 6,963,226.

According to the Notice of Investigation, the ITC has identified LSI Corporation of Milpitas, California and Seagate Technology of Cupertino, California as the respondents in this investigation.

The Notice of Investigation further indicates that the Office of Unfair Import Investigations will not participate as a party in this investigation.

Lastly, Chief ALJ Charles E. Bullock issued a notice indicating that Robert K. Rogers, Jr. will be the presiding Administrative Law Judge in this investigation.



 

The views expressed in this document are solely the views of the author and not Martindale-Hubbell. This document is intended for informational purposes only and is not legal advice or a substitute for consultation with a licensed legal professional in a particular case or circumstance.
 

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